INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "STACKED MEMORY DEVICE WITH IMPROVED PER-DIE POWER DELIVERY"

GENEVA, June 24 -- MICRON TECHNOLOGY, INC. (8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2024/055804) for "STACKED MEMORY DEVICE WITH IMPROVED PER-DIE POWER DELIVERY" on Nov 14, 2024. With publication no. WO/2025/128268, the details related to the patent application was published on Jun 19, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): AYYAPUREDDI, Sujeet (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006)

Abstract: A memory device including a plurality of memory dies positioned in a stack, the plurality of memory di...