INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION"

GENEVA, July 3 -- MICRON TECHNOLOGY, INC. (8000 South Federal Way, Post Office Box 6Boise, Idaho 83707-0006) filed a patent application (PCT/US2024/060481) for "SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION" on Dec 17, 2024. With publication no. WO/2025/136927, the details related to the patent application was published on Jun 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TAN, Kelvin Aik Boo (Block 282B, #04-577, Sengkang East AvenueSingapore 542282), YE, Seng Kim (Block 7, #17-15, Fernvale CloseSingapore 797488), CHONG, Chin Hui (Block 10H, #07-29 Braddell HillSingapore 579727), NG, ...