INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "SEMICONDUCTOR DIE COUPLING WITH INDUCTIVE COILS"

GENEVA, Oct. 28 -- MICRON TECHNOLOGY, INC. (8000 S. Federal WayBoise, Idaho 83716-9632) filed a patent application (PCT/US2025/023833) for "SEMICONDUCTOR DIE COUPLING WITH INDUCTIVE COILS" on Apr 09, 2025. With publication no. WO/2025/221530, the details related to the patent application was published on Oct 23, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HOLLIS, Timothy M. (8000 S. Federal WayBoise, Idaho 83716-9632)

Abstract: Systems and devices for semiconductor die coupling with inductive coils are described. A semiconductor device may include one or more inductive coils to enhance ...