INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "SEMICONDUCTOR DEVICES WITH WRAP-AROUND ARRAYS"

GENEVA, May 27 -- MICRON TECHNOLOGY, INC. (8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2024/051645) for "SEMICONDUCTOR DEVICES WITH WRAP-AROUND ARRAYS" on Oct 16, 2024. With publication no. WO/2025/106204, the details related to the patent application was published on May 22, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): AYYAPUREDDI, Sujeet (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006)

Abstract: A semiconductor device is presented. The semiconductor device includes a first memory mat associated with a first me...