INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "SEMICONDUCTOR DEVICE HEAT SPREADER AND METHOD"

GENEVA, Dec. 31 -- MICRON TECHNOLOGY, INC. (8000 So. Federal WayBoise, Idaho 83716-9632) filed a patent application (PCT/US2025/034355) for "SEMICONDUCTOR DEVICE HEAT SPREADER AND METHOD" on Jun 19, 2025. With publication no. WO/2025/264911, the details related to the patent application was published on Dec 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ZHOU, Wei (8000 S Federal WayBoise, Idaho 83716), PAREKH, Kunal R. (677 N. Morningside WayBoise, Idaho 83712)

Abstract: Example semiconductor devices and methods include a heat spreader die and a heat conducting layer adjacent to an act...