INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "SEMICONDUCTOR ASSEMBLIES WITH WIRE-BONDED TRACES AND METHODS FOR MAKING THE SAME"

GENEVA, May 14 -- MICRON TECHNOLOGY, INC. (8000 S. Federal Way, P.o. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2024/052454) for "SEMICONDUCTOR ASSEMBLIES WITH WIRE-BONDED TRACES, AND METHODS FOR MAKING THE SAME" on Oct 22, 2024. With publication no. WO/2025/096243, the details related to the patent application was published on May 08, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHE, Faxing (C/o Micron Technology, Inc.8000 S. Federal Way, P.o. Box 6Boise, ID 83707-0006), HUD, Amirul Afiq, Bin (C/o Micron Technology, Inc.8000 S. Federal Way, P.o. Box 6Boise, ID 83707-000...