GENEVA, Nov. 25 -- MICRON TECHNOLOGY, INC. (8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2025/029280) for "SELF-ALIGNED PATTERNING ON PACKAGE SUBSTRATE" on May 14, 2025. With publication no. WO/2025/240564, the details related to the patent application was published on Nov 20, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): BHUSHAN, Bharat (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006), PAREKH, Kunal, R. (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006), SINGH, Akshay, N. (c/o Micron Te...