INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "REDUNDANT BOND PADS IN STACKED SEMICONDUCTOR ARCHITECTURES"

GENEVA, Jan. 13 -- MICRON TECHNOLOGY, INC. (8000 S. Federal WayBoise, Idaho 83716-9632) filed a patent application (PCT/US2025/036263) for "REDUNDANT BOND PADS IN STACKED SEMICONDUCTOR ARCHITECTURES" on Jul 02, 2025. With publication no. WO/2026/011058, the details related to the patent application was published on Jan 08, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BHUSHAN, Bharat (8000 S. Federal WayBoise, Idaho 83716-9632), PAREKH, Kunal R. (8000 S. Federal WayBoise, Idaho 83716-9632), HEINECK, Lars P. (8000 S. Federal WayBoise, Idaho 83716-9632), SINGH, Akshay N. (8000 S. Federal Way...