INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "POWER ENVELOPE MODIFICATION FOR MEMORY SYSTEMS BASED ON TIME TO THERMAL THROTTLE"

GENEVA, July 3 -- MICRON TECHNOLOGY, INC. (8000 S. Federal WayBoise, Idaho 83716-9632) filed a patent application (PCT/US2024/039587) for "POWER ENVELOPE MODIFICATION FOR MEMORY SYSTEMS BASED ON TIME TO THERMAL THROTTLE" on Jul 25, 2024. With publication no. WO/2025/136459, the details related to the patent application was published on Jun 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): STEINMETZ, Cory M. (8000 S. Federal WayBoise, Idaho 83716-9632), WILKINS, Kyle J. (8000 S. Federal WayBoise, Idaho 83716-9632), THANOS, William N. (8000 S. Federal WayBoise, Idaho 83716-9632), MILLER, Cra...