INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "POWER AND SIGNAL DISTRIBUTION IN STACKED SEMICONDUCTOR SYSTEMS"

GENEVA, Jan. 20 -- MICRON TECHNOLOGY, INC. (8000 S. Federal WayBoise, Idaho 83716-9632) filed a patent application (PCT/US2025/036507) for "POWER AND SIGNAL DISTRIBUTION IN STACKED SEMICONDUCTOR SYSTEMS" on Jul 03, 2025. With publication no. WO/2026/015400, the details related to the patent application was published on Jan 15, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KING, Gregory A. (8000 S. Federal WayBoise, Idaho 83716-9632)

Abstract: Methods, systems, and devices for power and signal distribution in stacked semiconductor systems are described. A semiconductor system may include a...