INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "PAGE-BY-PAGE LEVEL SHAPING"

GENEVA, April 21 -- MICRON TECHNOLOGY, INC. (8000 S. Federal WayBoise, Idaho 83716-9632) filed a patent application (PCT/US2024/038358) for "PAGE-BY-PAGE LEVEL SHAPING" on Jul 17, 2024. With publication no. WO/2025/080323, the details related to the patent application was published on Apr 17, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BURICH, Mariano Eduardo (8000 S. Federal WayBoise, Idaho 83716-9632), PARTHASARATHY, Sivagnanam (8000 S. Federal WayBoise, Idaho 83716-9632), NGUYEN, Phong Sy (8000 S. Federal WayBoise, Idaho 83716-9632), WEINBERG, Yoav (8000 S. Federal WayBoise, Idaho 837...