INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "METHODS OF FORMING SEMICONDUCTOR WAFERS WITH BACKSIDE STOP PINS AND ASSEMBLIES RESULTING FROM SUCH METHODS"

GENEVA, Aug. 26 -- MICRON TECHNOLOGY, INC. (8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2025/010984) for "METHODS OF FORMING SEMICONDUCTOR WAFERS WITH BACKSIDE STOP PINS, AND ASSEMBLIES RESULTING FROM SUCH METHODS" on Jan 09, 2025. With publication no. WO/2025/174489, the details related to the patent application was published on Aug 21, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MCDONALD, Andrew, T. (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006)

Abstract: A method of forming a semiconductor wafer is provide...