INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "MEMORY WITH COOLING SYSTEMS USING THROUGH-SILICON TRENCHES AND ASSOCIATED SYSTEMS, DEVICES AND METHODS"

GENEVA, Dec. 24 -- MICRON TECHNOLOGY, INC. (8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2025/031344) for "MEMORY WITH COOLING SYSTEMS USING THROUGH-SILICON TRENCHES, AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS" on May 29, 2025. With publication no. WO/2025/259433, the details related to the patent application was published on Dec 18, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SREERAMANENI, Raghukiran (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006), GAJERA, Nevil, N. (c/o Micron Technology, Inc.8000 S. Federal W...