INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "HYBRID BONDING TECHNIQUES FOR STACKED SEMICONDUCTOR SYSTEMS"

GENEVA, Feb. 11 -- MICRON TECHNOLOGY, INC. (8000 S. Federal WayBoise, Idaho 83716-9632) filed a patent application (PCT/US2025/038706) for "HYBRID BONDING TECHNIQUES FOR STACKED SEMICONDUCTOR SYSTEMS" on Jul 22, 2025. With publication no. WO/2026/030058, the details related to the patent application was published on Feb 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KIM, Youngrae (8000 S. Federal WayBoise, Idaho 83716-9632), HUANG, Sui Chi (8000 S. Federal WayBoise, Idaho 83716-9632)

Abstract: Methods, systems, and devices for hybrid bonding techniques for stacked semiconductor systems...