INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "HIGH-SPEED AND HIGH-CONSISTENCY FLIP-FLOP CIRCUITS"

GENEVA, Dec. 10 -- MICRON TECHNOLOGY, INC. (8000 South Federal WayBoise, Idaho 83716-9632) filed a patent application (PCT/US2025/027207) for "HIGH-SPEED AND HIGH-CONSISTENCY FLIP-FLOP CIRCUITS" on May 01, 2025. With publication no. WO/2025/250299, the details related to the patent application was published on Dec 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HUBER, Brian W. (c/o Micron Technology, Inc.8000 South Federal WayBoise, Idaho 83716-9632), BECKER, Eric A. (c/o Micron Technology, Inc.8000 South Federal WayBoise, Idaho 83716-9632)

Abstract: A flip-flop circuit may be used to l...