INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "HIGH DIE STACK PACKAGE WITH SECONDARY INTERPOSER"

GENEVA, Jan. 20 -- MICRON TECHNOLOGY, INC. (8000 S. Federal Way, P.O. Box 6Boise, Idaho 83707-0006) filed a patent application (PCT/US2025/036483) for "HIGH DIE STACK PACKAGE WITH SECONDARY INTERPOSER" on Jul 03, 2025. With publication no. WO/2026/015396, the details related to the patent application was published on Jan 15, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YE, Seng Kim (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, Idaho 83707-0006), BOO, Kelvin Tan Aik (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, Idaho 83707-0006), NG, Hong Wan (c/o Mi...