INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "HIGH DIE STACK PACKAGE WITH MODULAR STRUCTURE"

GENEVA, Jan. 20 -- MICRON TECHNOLOGY, INC. (8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2025/036492) for "HIGH DIE STACK PACKAGE WITH MODULAR STRUCTURE" on Jul 03, 2025. With publication no. WO/2026/015398, the details related to the patent application was published on Jan 15, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BOO, Kelvin, Tan Aik (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006), YE, Seng, Kim (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006), NG, Hong, Wan (c/o Micron Tech...