INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "HIGH-BANDWIDTH MEMORY SYSTEM-IN-PACKAGE INTEGRATION BRINGUP"

GENEVA, Nov. 18 -- MICRON TECHNOLOGY, INC. (8000 So. Federal WayBoise, Idaho 83716-9632) filed a patent application (PCT/US2025/027531) for "HIGH-BANDWIDTH MEMORY SYSTEM-IN-PACKAGE INTEGRATION BRINGUP" on May 02, 2025. With publication no. WO/2025/235323, the details related to the patent application was published on Nov 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KARIYA, Rajesh Hariram (4243 S Rimview WayBoise, Idaho 83716), SOHN LEE, Joon Sik (5087 S Colusa AveMeridian, Idaho 83642)

Abstract: Systems and methods related to testing of designs for system-in-packages (SiP) comprising...