INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "HIGH BANDWIDTH MEMORY DEVICE BANDWIDTH SCALING AND ASSOCIATED SYSTEMS AND METHODS"

GENEVA, Nov. 25 -- MICRON TECHNOLOGY, INC. (8000 S. Federal WayP.O. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2025/028678) for "HIGH BANDWIDTH MEMORY DEVICE BANDWIDTH SCALING AND ASSOCIATED SYSTEMS AND METHODS" on May 09, 2025. With publication no. WO/2025/240260, the details related to the patent application was published on Nov 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): AYYAPUREDDI, Sujeet (c/o Micron Technology, Inc.8000 S. Federal WayP.O. Box 6Boise, ID 83707-0006)

Abstract: A SiP device can include a base substrate and a processing unit. The SiP can also inc...