INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "HETEROGENOUS INTEGRATION OF SEMICONDUCTOR STRUCTURES"

GENEVA, Dec. 31 -- MICRON TECHNOLOGY, INC. (8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2025/031791) for "HETEROGENOUS INTEGRATION OF SEMICONDUCTOR STRUCTURES" on May 30, 2025. With publication no. WO/2025/264377, the details related to the patent application was published on Dec 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BHUSHAN, Bharat (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006), MCDANIEL, Terrence, B. (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006), KIRBY, Kyle, K. (c/...