INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "HEAT-MITIGATING HIGH-BANDWIDTH DEVICES IN SYSTEM-IN-PACKAGE DEVICES AND ASSOCIATED SYSTEMS AND METHODS"

GENEVA, Oct. 14 -- MICRON TECHNOLOGY, INC. (8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2025/019259) for "HEAT-MITIGATING HIGH-BANDWIDTH DEVICES IN SYSTEM-IN-PACKAGE DEVICES AND ASSOCIATED SYSTEMS AND METHODS" on Mar 10, 2025. With publication no. WO/2025/212237, the details related to the patent application was published on Oct 09, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YANG, Lingming (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006), SREERAMANENI, Raghukiran (c/o Micron Technology, Inc.8000 S. Federal Way, P...