INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "FRONT-TO-FRONT BONDING IN A STACKED MEMORY SYSTEM"

GENEVA, July 30 -- MICRON TECHNOLOGY, INC. (8000 S. Federal WayBoise, Idaho 83716-9632) filed a patent application (PCT/US2025/011710) for "FRONT-TO-FRONT BONDING IN A STACKED MEMORY SYSTEM" on Jan 15, 2025. With publication no. WO/2025/155620, the details related to the patent application was published on Jul 24, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BHUSHAN, Bharat (8000 S. Federal WayBoise, Idaho 83716-9632), PAREKH, Kunal R. (8000 S. Federal WayBoise, Idaho 83716-9632), SINGH, Akshay N. (8000 S. Federal WayBoise, Idaho 83716-9632)

Abstract: Methods, systems, and devices for ...