INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "FACILITATING WAFER DEBONDING BY INTRODUCING MOISTURE TO BONDING INTERFACE"

GENEVA, Nov. 18 -- MICRON TECHNOLOGY, INC. (8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2025/027393) for "FACILITATING WAFER DEBONDING BY INTRODUCING MOISTURE TO BONDING INTERFACE" on May 01, 2025. With publication no. WO/2025/235299, the details related to the patent application was published on Nov 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KIRBY, Kyle, K. (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006), BAYLESS, Andrew, M. (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006), P...