INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "ENDURANCE GROUP FOR TIERED STORAGE APPLICATIONS"

GENEVA, Oct. 28 -- MICRON TECHNOLOGY, INC. (8000 S. Federal WayBoise, Idaho 83716-9632) filed a patent application (PCT/US2025/024384) for "ENDURANCE GROUP FOR TIERED STORAGE APPLICATIONS" on Apr 11, 2025. With publication no. WO/2025/221619, the details related to the patent application was published on Oct 23, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MARONEY, John E. (8000 S. Federal WayBoise, Idaho 83716-9632), WILKINS, Kyle J. (8000 S. Federal WayBoise, Idaho 83716-9632), LEONARD, Roy (8000 S. Federal WayBoise, Idaho 83716-9632), HOLMSTROM, David Alan (8000 S. Federal WayBoise, Id...