INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "DOUBLE-SIDED STORAGE NODES IN TWO DIRECTIONS FOR THREE-DIMENSIONAL (3D) MEMORY"

GENEVA, Dec. 10 -- MICRON TECHNOLOGY, INC. (Mail Stop 5078000 South Federal WayP.O. Box 6Boise, Idaho 83707-0006) filed a patent application (PCT/US2025/031503) for "DOUBLE-SIDED STORAGE NODES IN TWO DIRECTIONS FOR THREE-DIMENSIONAL (3D) MEMORY" on May 29, 2025. With publication no. WO/2025/250837, the details related to the patent application was published on Dec 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): NAKAMURA, Yoshitaka (309 E Brookhollow Dr.Boise, Idaho 83706), SILLS, Scott E. (1316 S. Gourley StreetBoise, Idaho 83705), LEE, Si-Woo (15185 Alondra LnSaratoga, California 95070)...