INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "CIRCUITS FOR CONNECTING HIGH-BANDWIDTH MEMORY CUBES TO A HOST DEVICE AND ASSOCIATED SYSTEMS AND METHODS"

GENEVA, Dec. 23 -- MICRON TECHNOLOGY, INC. (8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2025/030066) for "CIRCUITS FOR CONNECTING HIGH-BANDWIDTH MEMORY CUBES TO A HOST DEVICE, AND ASSOCIATED SYSTEMS AND METHODS" on May 19, 2025. With publication no. WO/2025/259415, the details related to the patent application was published on Dec 18, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SREERAMANENI, Raghukiran (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006), GAJERA, Nevil, N. (c/o Micron Technology, Inc.8000 S. Federal W...