INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "APPARATUS WITH REDUCED INTERCONNECT PITCH AND METHODS OF MANUFACTURING THE SAME"

GENEVA, Jan. 27 -- MICRON TECHNOLOGY, INC. (8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2025/037954) for "APPARATUS WITH REDUCED INTERCONNECT PITCH AND METHODS OF MANUFACTURING THE SAME" on Jul 16, 2025. With publication no. WO/2026/019957, the details related to the patent application was published on Jan 22, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): NAYINI, Manish (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006), NGUYEN, Quang (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006), CH...