INTERNATIONAL PATENT: MICRON TECHNOLOGY, INC. FILES APPLICATION FOR "ALIGNMENT MARKERS FOR WAFER BONDING AND ASSOCIATED SYSTEMS AND METHODS"

GENEVA, April 30 -- MICRON TECHNOLOGY, INC. (8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2024/048483) for "ALIGNMENT MARKERS FOR WAFER BONDING AND ASSOCIATED SYSTEMS AND METHODS" on Sep 25, 2024. With publication no. WO/2025/085227, the details related to the patent application was published on Apr 24, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KIRBY, Kyle, K. (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006), FISCHER, Mark (c/o Micron Technology, Inc.8000 S. Federal Way, P.O. Box 6Boise, ID 83707-0006)

Abstract:...