GENEVA, May 6 -- MICRON TECHNOLOGY, INC. (8000 S. Federal Way, P.o. Box 6Boise, ID 83707-0006) filed a patent application (PCT/US2024/051869) for "ADDITIVE APPROACHES TO MODIFYING WAFER GEOMETRY" on Oct 18, 2024. With publication no. WO/2025/090366, the details related to the patent application was published on May 01, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): PAREKH, Kunal, R. (C/o Micron Technology, Inc.8000 S. Federal Way, P.o. Box 6Boise, ID 83707-0006)
Abstract:
A method for modifying a geometry of a wafer comprises measuring a local geometry for each of a plurality edge locati...