INTERNATIONAL PATENT: MICROCHIP TECHNOLOGY INCORPORATED FILES APPLICATION FOR "METHOD OF ALIGNMENT OF ELECTRICAL COMPONENTS OF AN ELECTRICAL APPARATUS WITH A SUPPORT ASSEMBLY"

GENEVA, Feb. 25 -- MICROCHIP TECHNOLOGY INCORPORATED (2355 West Chandler BlvdChandler, Arizona 85224-6199) filed a patent application (PCT/US2024/017115) for "METHOD OF ALIGNMENT OF ELECTRICAL COMPONENTS OF AN ELECTRICAL APPARATUS WITH A SUPPORT ASSEMBLY" on Feb 23, 2024. With publication no. WO/2025/038136, the details related to the patent application was published on Feb 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LAM, Mankit (4355 Kincaid CourtColorado Springs, Colorado 80906)

Abstract: An apparatus includes first electrical components, wherein a respective first electrical co...