INTERNATIONAL PATENT: MICROCHIP TECHNOLOGY INCORPORATED FILES APPLICATION FOR "METHOD INCLUDING UNDER-ETCHING AN ION-INDUCED DAMAGE LAYER TO FACILITATE SEPARATION OF A SUBSTRATE FILM LAYER FROM AN UNDERLYING SUBSTRATE BULK REGION"

GENEVA, Nov. 4 -- MICROCHIP TECHNOLOGY INCORPORATED (2355 West Chandler Blvd.Chandler, Arizona 85224-6199) filed a patent application (PCT/US2024/052491) for "METHOD INCLUDING UNDER-ETCHING AN ION-INDUCED DAMAGE LAYER TO FACILITATE SEPARATION OF A SUBSTRATE FILM LAYER FROM AN UNDERLYING SUBSTRATE BULK REGION" on Oct 23, 2024. With publication no. WO/2025/226299, the details related to the patent application was published on Oct 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MAXIMENKO, Sergey (919 Quail Lake Circle, Apt. 201Colorado Springs, Colorado 80906)

Abstract: A method includes p...