INTERNATIONAL PATENT: MICROCHIP TECHNOLOGY INCORPORATED FILES APPLICATION FOR "INTEGRATED CIRCUIT DEVICE INCLUDING DIES ARRANGED FACE-TO-FACE"

GENEVA, Feb. 18 -- MICROCHIP TECHNOLOGY INCORPORATED (2355 West Chandler Blvd.Chandler, AZ 85224-6199) filed a patent application (PCT/US2024/014923) for "INTEGRATED CIRCUIT DEVICE INCLUDING DIES ARRANGED FACE-TO-FACE" on Feb 08, 2024. With publication no. WO/2025/034251, the details related to the patent application was published on Feb 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KOVATS, Julius (34 Washington AvenueManitou Springs, CO 80829)

Abstract: A method of forming an integrated circuit (IC) device includes forming a first die block including a first die block substrate, a ...