INTERNATIONAL PATENT: MICROCHIP TECHNOLOGY INCORPORATED FILES APPLICATION FOR "HYBRID SEMICONDUCTOR WAFER AND METHOD OF FORMING"

GENEVA, April 16 -- MICROCHIP TECHNOLOGY INCORPORATED (2355 West Chandler Blvd.Chandler, Arizona 85224-6199) filed a patent application (PCT/US2024/022592) for "HYBRID SEMICONDUCTOR WAFER AND METHOD OF FORMING" on Apr 02, 2024. With publication no. WO/2025/075671, the details related to the patent application was published on Apr 10, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): NAGEL, Steve (1201 E. Springfield Pl.Chandler, Arizona 85286), CHEN, Bomy (36463 Dijon DriveNewark, California 94560), ODEKIRK, Bruce (1985 SW Warwick AvePortland, Oregon 97225), KHOSROPOUR, Pejman (392 Harrison Av...