INTERNATIONAL PATENT: MICROCHIP TECHNOLOGY INCORPORATED FILES APPLICATION FOR "HIGH DEFECT SIC WAFER WITH DEVICE LAYER AND METHODS OF MANUFACTURE"

GENEVA, Sept. 30 -- MICROCHIP TECHNOLOGY INCORPORATED (2355 West Chandler Blvd.Chandler, Arizona 85224-6199) filed a patent application (PCT/US2024/046085) for "HIGH DEFECT SiC WAFER WITH DEVICE LAYER AND METHODS OF MANUFACTURE" on Sep 11, 2024. With publication no. WO/2025/198634, the details related to the patent application was published on Sep 25, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): NAGEL, Steve (1201 E. Springfield Pl.Chandler, Arizona 85286), CHEN, Bomy (36463 Dijon DriveNewark, California 94560)

Abstract: Aspects provide forming hLDD SiC substrate wafers having a number o...