INTERNATIONAL PATENT: MICROCHIP TECHNOLOGY INCORPORATED FILES APPLICATION FOR "DUAL RESONATOR STRUCTURE FOR TEMPERATURE-COMPENSATED OSCILLATORS, INCLUDING RELATED APPARATUSES"

GENEVA, March 10 -- MICROCHIP TECHNOLOGY INCORPORATED (2355 West Chandler BlvdChandler, Arizona 85224-6199) filed a patent application (PCT/US2024/044334) for "DUAL RESONATOR STRUCTURE FOR TEMPERATURE-COMPENSATED OSCILLATORS, INCLUDING RELATED APPARATUSES" on Aug 29, 2024. With publication no. WO/2025/049682, the details related to the patent application was published on Mar 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LEE, Seungbae (1419 Antonio LnSan Jose, California 95117)

Abstract: An apparatus comprises a micromechanical system including a semiconductor body. The semiconductor...