INTERNATIONAL PATENT: MICROCHIP TECHNOLOGY INCORPORATED FILES APPLICATION FOR "APPARATUS FORMED FROM ELECTRONIC COMPONENTS HAVING DIFFERENT RESPECTIVE THICKNESSES AND METHODS OF FORMING AN APPARATUS FROM ELECTRONIC COMPONENTS HAVING DIFFERENT RESPECTIVE THICKNESSES"

GENEVA, July 14 -- MICROCHIP TECHNOLOGY INCORPORATED (2355 West Chandler BlvdChandler, Arizona 85224-6199) filed a patent application (PCT/US2024/033531) for "APPARATUS FORMED FROM ELECTRONIC COMPONENTS HAVING DIFFERENT RESPECTIVE THICKNESSES AND METHODS OF FORMING AN APPARATUS FROM ELECTRONIC COMPONENTS HAVING DIFFERENT RESPECTIVE THICKNESSES" on Jun 12, 2024. With publication no. WO/2025/147286, the details related to the patent application was published on Jul 10, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LAM, Mankit (4355 Kincaid CourtColorado Springs, Colorado 80906)

Abstract: ...