INTERNATIONAL PATENT: META PLATFORMS TECHNOLOGIES, LLC FILES APPLICATION FOR "FLEX ASSEMBLIES FOR ELECTRONICALLY COUPLING SENSORS OF A FRONT-FACING OUTER COVER OF A HEAD-WEARABLE DEVICE TO A LOGIC BOARD THEREOF AND METHODS OF MANUFACTURING THEREFOR"

GENEVA, April 21 -- META PLATFORMS TECHNOLOGIES, LLC (1 Meta WayMenlo Park, California 94025) filed a patent application (PCT/US2024/042834) for "FLEX ASSEMBLIES FOR ELECTRONICALLY COUPLING SENSORS OF A FRONT-FACING OUTER COVER OF A HEAD-WEARABLE DEVICE TO A LOGIC BOARD THEREOF, AND METHODS OF MANUFACTURING THEREFOR" on Aug 17, 2024. With publication no. WO/2025/080342, the details related to the patent application was published on Apr 17, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): IYER, Vinay Arvindl (1 Meta WayMenlo Park, California 94025), TANG, Lucas Wen (1 Meta WayMenlo Park, Calif...