INTERNATIONAL PATENT: META PLATFORMS, INC. FILES APPLICATION FOR "SELF-HEALING SOLDER INTERCONNECTION"

GENEVA, May 19 -- META PLATFORMS, INC. (1 Meta WayMenlo Park, California 94025) filed a patent application (PCT/US2024/054923) for "SELF-HEALING SOLDER INTERCONNECTION" on Nov 07, 2024. With publication no. WO/2025/101752, the details related to the patent application was published on May 15, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PICHUMANI, Pradip Sairam (1 Meta WayMenlo Park, California 94025), BARYKINA-TASSA, Olga Vladimirovna (1 Meta WayMenlo Park, California 94025)

Abstract: Disclosed technology provides a solder ball including an outer layer having a first conductive materi...