INTERNATIONAL PATENT: MERCK PATENT GMBH FILES APPLICATION FOR "POST-EXPOSURE BAKE LESS CHEMICALLY AMPLIFIED PHOTORESIST COMPOSITION"

GENEVA, July 3 -- MERCK PATENT GMBH (Frankfurter StraBe 25064293 Darmstadt) filed a patent application (PCT/EP2024/086516) for "POST-EXPOSURE BAKE LESS CHEMICALLY AMPLIFIED PHOTORESIST COMPOSITION" on Dec 16, 2024. With publication no. WO/2025/132182, the details related to the patent application was published on Jun 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LU, Lei (c/o Versum Materials US, LLS8555 South River ParkwayTempe, Arizona 85284), CHEN, Hung-Yang (c/o Versum Materials US, LLS8555 South River ParkwayTempe, Arizona 85284), CHEN, Chunwei (c/o Versum Materials US, LLS8555 Sou...