INTERNATIONAL PATENT: MEDTRONIC, INC. FILES APPLICATION FOR "INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME"

GENEVA, March 9 -- MEDTRONIC, INC. (710 Medtronic ParkwayMinneapolis, Minnesota 55432) filed a patent application (PCT/IB2024/056965) for "INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME" on Jul 18, 2024. With publication no. WO/2025/046333, the details related to the patent application was published on Mar 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WASSON, James R. (710 Medtronic ParkwayMinneapolis, Minnesota 55432), HENSCHEL, Mark E. (710 Medtronic ParkwayMinneapolis, Minnesota 55432), SHI, Songhua (710 Medtronic ParkwayMinneapolis, Minnesota 55432), DELEON, Christine M. (71...