GENEVA, Oct. 5 -- MCPP INNOVATION LLC (1-1, Marunouchi 1-chome, Chiyoda-ku, Tokyo1008251), ＭＣＰＰイノベーション合同会社 (東京都千代田区丸の内一丁目１番１号) filed a patent application (PCT/JP2025/012933) for "METHOD FOR PRODUCING MULTI-LAYER MOLDED BODY, AND MULTI-LAYER MOLDED BODY" on Mar 28, 2025. With publication no. WO/2025/206363, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Inte...