GENEVA, July 8 -- MAX CO., LTD. (6-6, Nihonbashi Hakozaki-cho, Chuo-ku, Tokyo1038502), マックス株式会社 (東京都中央区日本橋箱崎町６番６号) filed a patent application (PCT/JP2024/044251) for "BINDING SYSTEM AND BINDING MACHINE" on Dec 13, 2024. With publication no. WO/2025/142564, the details related to the patent application was published on Jul 03, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): IWAKI Kozo (c/o MAX CO., LTD., 6-6, Nihonbashi Hakozak...