INTERNATIONAL PATENT: MATERION CORPORATION FILES APPLICATION FOR "MATRIX OF LID ASSEMBLIES FOR ELECTRONIC PACKAGES"

GENEVA, Dec. 24 -- MATERION CORPORATION (6070 Parkland BoulevardMayfield Heights, Ohio 44124) filed a patent application (PCT/US2025/033532) for "MATRIX OF LID ASSEMBLIES FOR ELECTRONIC PACKAGES" on Jun 13, 2025. With publication no. WO/2025/259973, the details related to the patent application was published on Dec 18, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KOTHANDAPANI, Ramesh (c/o Materion Corporation6070 Parkland BoulevardMayfield Heights, Ohio 44124), TAN, SinLi (c/o Materion Corporation6070 Parkland BoulevardMayfield Heights, Ohio 44124), WANG, Chen (c/o Materion Corporation607...