GENEVA, April 21 -- MASSACHUSETTS INSTITUTE OF TECHNOLOGY (77 Massachusetts AvenueCambridge, Massachusetts 02139) filed a patent application (PCT/US2024/019512) for "3D PROCESSOR" on Mar 12, 2024. With publication no. WO/2025/080293, the details related to the patent application was published on Apr 17, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SONG, William, S. (8 Bates RoadLexington, Massachusetts 02421)

Abstract: Described is a device having three-dimensional (3D) integration of a DRAM die and processor ASIC. Such an integrated device achieves much higher memory bandwidth and low...