INTERNATIONAL PATENT: MARVELL ASIA PTE., LTD. FILES APPLICATION FOR "HYBRID-BONDED INTERPOSER FOR HIGH-DENSITY INTERFACE CONNECTIONS IN SEMICONDUCTOR DEVICES"

GENEVA, Oct. 15 -- MARVELL ASIA PTE., LTD. (Tai Seng Centre3 Irving Road #10-01Singapore 369522) filed a patent application (PCT/US2025/023016) for "HYBRID-BONDED INTERPOSER FOR HIGH-DENSITY INTERFACE CONNECTIONS IN SEMICONDUCTOR DEVICES" on Apr 03, 2025. With publication no. WO/2025/212930, the details related to the patent application was published on Oct 09, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHAKRAVARTI, Aatreya (65 Winooski Falls Way, Apt B306Winooski, Vermont 05404), MACIAN RUIZ, Carlos (103 Birch Wood CtLos Gatos, California 95032), KUEMERLE, Mark William (7 Maple St ExtE...