INTERNATIONAL PATENT: MARVELL ASIA PTE LTD FILES APPLICATION FOR "INTEGRATION OF BGA PACKAGE ON PCB WITH REDUCED CROSSTALK"

GENEVA, Jan. 6 -- MARVELL ASIA PTE LTD (Tai Seng Centre,3 Irving Road #10-01,Singapore 369522) filed a patent application (PCT/SG2025/050427) for "INTEGRATION OF BGA PACKAGE ON PCB WITH REDUCED CROSSTALK" on Jun 24, 2025. With publication no. WO/2026/005707, the details related to the patent application was published on Jan 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SHAIK, Ershad (Above Kavitha & Associates,Konena Agrahara,Bangalore 560017)

Abstract: A device includes an electrical board including a plurality of ball grid arrays (BGA) groups. Each BGA group of the plurality of BGA ...