GENEVA, Jan. 27 -- MARVELL ASIA PTE LTD (Tai Seng Centre3 Irving Road, #10-01Singapore 369522) filed a patent application (PCT/IB2024/056932) for "CUSTOMIZED HEAT DISSIPATION FROM DIFFERENT TYPES OF INTEGRATED CIRCUIT DIES PACKAGED ON A COMMON SUBSTRATE" on Jul 17, 2024. With publication no. WO/2025/017498, the details related to the patent application was published on Jan 23, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): BENES, Carl E. (157 S Main St.Waterbury, Vermont 05676), UPADHYAYA, Meenakshi (9 Pearce Mitchell Pl.Stanford, California 94305), DILLON, Joshua F. (69 Deer RunStowe, Verm...