INTERNATIONAL PATENT: MACDERMID ENTHONE INC. FILES APPLICATION FOR "METHOD FOR IMPROVING ADHESION BETWEEN METALLIZATION LAYERS AND OZONE-ETCHED PLASTICS"

GENEVA, July 3 -- MACDERMID ENTHONE INC. (245 Freight StreetWaterbury, CT 06502) filed a patent application (PCT/US2024/055022) for "METHOD FOR IMPROVING ADHESION BETWEEN METALLIZATION LAYERS AND OZONE-ETCHED PLASTICS" on Nov 08, 2024. With publication no. WO/2025/136523, the details related to the patent application was published on Jun 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KONIGSHOFEN, Andreas (Lohrstr. 6A51371 Leverkusen), FETAHOVIC, Almedina (Pfaffenberger Weg 942659 Solingen), SCHAFER, Stefan (Nummener Strasse 7742653 Solingen)

Abstract: A method of metallizing plastic ...