GENEVA, Sept. 2 -- LINTEC CORPORATION (23-23, Honcho, Itabashi-ku, Tokyo1730001), リンテック株式会社 (東京都板橋区本町２３番２３号) filed a patent application (PCT/JP2025/004242) for "ADHESIVE SHEET FOR WORKPIECE PROCESSING AND METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE" on Feb 07, 2025. With publication no. WO/2025/177868, the details related to the patent application was published on Aug 28, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (W...