GENEVA, Feb. 17 -- LINK-US CO., LTD. (2-6-23, Shinyokohama, Kohoku-ku, Yokohama-shi, Kanagawa2220033), 株式会社ＬＩＮＫ－ＵＳ (神奈川県横浜市港北区新横浜二丁目６番地２３) filed a patent application (PCT/JP2024/027222) for "ULTRASONIC BONDING CHIP, ULTRASONIC BONDING DEVICE USING SAME, AND ULTRASONIC BONDING METHOD" on Jul 30, 2024. With publication no. WO/2025/033263, the details related to the patent application was published on Feb 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, whi...